Department of Industrial Engineering and Management
National Chiao Tung University
300 Hsinchu, Taiwan, R.O.C.
The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. These three properties make a factory with BGA packaging difficult to maximize its capacity utilization while having all orders meeting their due dates. Therefore, we design a master production scheduling (MPS) system for wafer bumping process which aims for having high due date achievement as well as doing customer order promising. The MPS system first estimates the cycle time roughly. Then a mixed integer programming (MIP) model is applied to optimize the setup schedule. With estimated cycle times and setup schedules, the master production scheduling system can plan master production schedules which are capable to meet the due date requirement and can handle the task of customer order promising. The case studies show that this MPS system generates feasible master production schedules with high due date achievement.
Keywords: Master Production Scheduling, Ball Grid Array Packaging, Setup Time, Mixed Integer Programming
(*Contact: E-mail shchung@mail.nctu.edu.tw )
Cite this article as: Shu-Hsing Chung, Ching-Kuei Kao, Yu-Chun Huang and Shu-Ming Chuang, "The Design of Master Production Scheduling System for Ball Grid Array Packaging Process," Journal of the Chinese Institute of Industrial Engineers, 23, 245-252 (2006).